Aoi Process Development Engineer Panel Packaging Jobs in Malaysia

opportunities available in Malaysia

Available Jobs ()

Full-time

AOI Process Development Engineer – Panel Packaging

STMicroelectronics • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

AOI Process Development Engineer – Panel Packaging

STMicro • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

AOI Process Development Engineer — Panel Packaging

STMicroelectronics • Muar, Johor, Malaysia

View Placement Details
Full-time

Process Development Engineer (AOI)

STMicro • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

Process Development Engineer (AOI)

STMicroelectronics • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

Process Development Engineer (AOI)

STMicroelectronics • Muar, Johor, Malaysia

View Placement Details
Full-time

Senior AOI Engineer – Advanced Packaging Leader

TF-AMD Penang • Penang, Malaysia, Penang, Malaysia

View Placement Details
Full-time

Packaging Module Development Engineer

Intel Corporation • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

AOI Engineer (SMT) (Opportunity to work in Japan)

Reeracoen Recruitment • Malacca City, Malacca, Malaysia

View Placement Details
Full-time

Senior Production Engineer

Reeracoen Recruitment • Malacca City, Malacca, Malaysia

View Placement Details
Full-time

Process Improvement/Yield Engineer

Reeracoen Recruitment • Malacca City, Malacca, Malaysia

View Placement Details
Full time

Senior Manager, Product Management

Nordson Corporation • George Town, Pulau Pinang, Malaysia

View Placement Details
Full-time

AOI Engineer

TF-AMD Penang • Penang, Malaysia, Penang, Malaysia

View Placement Details
Full-time

Test Engineer (Debug/ Functional Test/AOI/AXI)

Plexus Malaysia Sdn Bhd • Penang, Malaysia, Penang, Malaysia

View Placement Details
Full-time

Packaging Module Development Engineer

Intel Corporation • Kulim, Kedah, Malaysia

View Placement Details
Full-time

Process Engineer

Unisem • Perak, Malaysia, Perak, Malaysia

View Placement Details
Full-time

Quality Engineer (Teradyne, Penang)

Teradyne • Penang, Malaysia, Penang, Malaysia

View Placement Details
Full-time

Production Engineering Executive (Car Electronics)

Denso • Bandar Baru Bangi, Selangor, Malaysia

View Placement Details
Full-time

Staff Test Engineer

AURIGHTEC MALAYSIA SDN. BHD. • Kedah, Malaysia, Kedah, Malaysia

View Placement Details
Full-time

SMT Equipment/Process Engineer

XP Power • Perak, Malaysia, Perak, Malaysia

View Placement Details
Full-time

End-of-Line Process Engineer – Panel Packaging & Optimization

STMicroelectronics • Muar, Johor, Malaysia

View Placement Details
Full-time

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Intel Corporation • Kulim, Kedah, Malaysia

View Placement Details
Full-time

SPI / AOI Field Application Engineer

Test Research Innovation Malaysia • Kulai, Johor, Malaysia

View Placement Details
Full-time

Senior PCBA Test Engineering Lead (AOI/ICT/FCT)

AURIGHTEC MALAYSIA SDN. BHD. • Kedah, Malaysia, Kedah, Malaysia

View Placement Details
full-time

SMT Equipment/Process Engineer

XP Power • Seri Iskander, Perak, Malaysia

View Placement Details
Full-time

AOI Engineer (SMT) - Precision PCB Inspection in Japan

Reeracoen Recruitment • Malacca City, Malacca, Malaysia

View Placement Details
Full-time

AOI & Yield Engineer: PCB Inspection & AI-Driven QA

Reeracoen Recruitment • Malacca City, Malacca, Malaysia

View Placement Details
Full-time

Packaging Module Engineer: SMT & PCB Innovation

Intel Corporation • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

Principal Packaging Engineer: Lead Frame & NPI Expert

Skyworks Solutions, Inc. • Malaysia, , , Malaysia, Malaysia

View Placement Details
Full-time

CUF TD Module Engineer

Intel Corporation • Malaysia, , , Malaysia, Malaysia

View Placement Details