Full-time
Wire Bond Process Engineer – NPI & Cost Reduction
Posted by STMicroelectronics • Muar, Johor, Malaysia
About the Role
A global semiconductor leader in Malaysia is seeking a skilled engineer to develop and industrialize wire bond processes. The ideal candidate will have a master's or bachelor's degree in engineering and at least 5 years of experience with ball bonding processes. Responsibilities include supporting qualification lots and driving cost reduction projects. The company is committed to diversity, equity, and inclusion in its workplace culture, providing opportunities for growth and learning.
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