About the Role
A leading semiconductor company in Ipoh, Malaysia, seeks a Wire Bond Development Engineer. The successful candidate will lead process improvements and ensure high-quality wire bonding processes by supervising engineering teams. Responsibilities include developing productivity standards and providing hands-on technical support. Ideal candidates have a Bachelor's in Engineering and at least one year in semiconductor manufacturing, with knowledge of wire bonding processes and statistical methods. This is an excellent opportunity to further your career in a dynamic environment.
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