Full-time
Wire Bond Process Development Engineer – Packaging R&D
Posted by Nexperia • seremban, negeri sembilan, Malaysia
About the Role
Nexperia is seeking a Process Development Engineer to develop and optimize semiconductor assembly processes, ensuring manufacturability and reliability for new products.
This role involves driving process development from concept to stable manufacturing, with responsibilities including technical discussions and applying statistical tools for data-based decisions. The ideal candidate will have a bachelor's degree in engineering and experience in semiconductor environments, along with strong communication and analytical skills.
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