About the Role
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**Job Description:**
• Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.,
• Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.
• Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN
• Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball ma...
**1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)**
**2. If you already have a Candidate Account, please Sign-In before you apply.**
**Job Description:**
• Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc.,
• Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice.
• Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN
• Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball ma...
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