Regular Full-Time

Staff Package Development Engineer

Posted by Power Integrations • Pasig, Metro Manila, Philippines

📍 Pasig, Metro Manila 🕒 February 21, 2026

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About the Role

Description
Job DescriptionResponsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.
Responsible for Developing new assembly technologies such as:
Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.
Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip Bonding
High CTI, high Thermal, Low Stress Vacuum assisted Molding Technologies
Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
Drive alignment between GaN Power Discrete design requirements and supplier capabilities, to enable new product development and volume manufacturing of GaN Power Discrete products
Run p...
                

Job Details

Location Pasig, Metro Manila
Job Type Regular Full-Time
Category Engineers
Posted February 21, 2026
Deadline April 02, 2026

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