About the Role
We are seeking a top-tier cooling technology expert to lead innovation in data center cooling and future advanced thermal management. You will drive R&D of liquid cooling, CDU, high‑heat‑flux chip cooling, and next‑generation thermal technologies, supporting JCI global leadership in AI computing cooling.
What you will do:
1. Define and lead the technology roadmap for data center cooling and next‑generation advanced thermal management.
2. Architect and develop high‑power cooling solutions: direct liquid cooling, 2 phase liquid cooling, microchannel related, CDU (Cooling Distribution Unit), manifold, and immersion cooling systems.
3. Conduct high‑heat‑flux thermal design for AI chips, optimize thermal resistance, pressure drop, flow uniformity and heat dissipation performance.
4. Provide thermal & fluid simulation model guidelines or principles with system level cooling architecture.
5. Lead design, validation and mass production of CDU syste...
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