Full-time

Staff Engineer

Posted by Nexperia • Seremban, Negeri Sembilan, Malaysia

📍 Seremban, Negeri Sembilan 🕒 March 01, 2026

About the Role

We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines , and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.

What You Will Do:

  • Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
  • Develop, implement, and improve die attach processes for semiconductor devices.
  • Troubleshoot equipment and process issues to maintain high yield and reliability.
  • Collaborate with cross-functional teams to support new product introductions.
  • Analyze process and equipment data to identify trends and implement corrective actions.
  • Drive continuo...

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