Full-time
Staff Engineer, Packaging FA (Semiconductor Devices)
Posted by Sandisk • batu kawan, penang, Malaysia
About the Role
Sandisk in Batu Kawan, Malaysia is seeking an experienced Device Physical Failure Analysis (PFA) Engineer to support advanced semiconductor chip development. The role emphasizes mandatory hands-on SEM and FIB expertise to influence package and product design.
The ideal candidate should possess a Bachelor's degree in a relevant field and over three years of direct experience in physical failure analysis with semiconductor devices. Excellent communication skills and teamwork capabilities are essential.
#J-18808-LjbffrReady to Apply?
Submit your application today and take the next step in your career journey with Sandisk.
Apply Now