Staff Engineer, Packaging Engineering (Device Physical Failure Analysis)

We are seeking an experienced Device Physical Failure Analysis (PFA) Engineer with mandatory hands-on SEM and FIB expertise to support advanced semiconductor chip and package development. This role is part of the Chip Package Integration (CPI) Failure Analysis function and plays a key role in improving device reliability and influencing package and product design. The position interfaces closely with wafer fabrication (NAND and ASIC), package and product design teams, electrical and physical characterization, assembly R&D, and other process engineering groups.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Perform device-level physical failure analysis (PFA) using SEM and FIB techniques (mandatory).
• Conduct FIB cross-sectioning, delayering, and defect localization for root-cause analysis.
• Utilize SEM imaging to analyze device structures, interfaces, and failure m...