About the Role
**Job Summary:**
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
**Competencies**
+ Leading WB Set-up fo New Product Introductions
+ Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
+ Establishing **process windows** using DOE and pareto analysis
+ Ability to improve **Cpk/Cp and DPMO** for WB parameters
+ Root‑cause analysis of **bond lifts, non‑sticks, wire breaks, cratering**
+ Correlation of WB defects to **substrate, leadframe, die, and mold compound inte...
onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.
**Competencies**
+ Leading WB Set-up fo New Product Introductions
+ Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
+ Establishing **process windows** using DOE and pareto analysis
+ Ability to improve **Cpk/Cp and DPMO** for WB parameters
+ Root‑cause analysis of **bond lifts, non‑sticks, wire breaks, cratering**
+ Correlation of WB defects to **substrate, leadframe, die, and mold compound inte...
Ready to Apply?
Submit your application today and take the next step in your career journey with onsemi.
Apply Now