Sr. Manager, Engineering

• Research and implementation of new technology, new processes, roadmaps, NPI for die processing services.
• Monitor and improve throughput, quality, yield, and uptime of wafer plating equipment/processes.
• Update and maintain documentation for all new NTI-NPI technology.
• Facilitate necessary experiments (DOE format) to troubleshoot quality issues.

Education:

• Bachelors or Masters in Mechanical, Chemical, or Industrial Engineering.
• Job experience or other technical/engineering education can be substituted for educational preferences.

Required Skills:

• Understanding of die processing equipment and processes.
• Troubleshooting, analytical and problem-solving skills, and process control fundamental understanding.
• Ability to analyze statistical data; familiarity with software such as JMP is preferred.
• Good communication and interpersonal skills for working with ...