Full-time

Senior Staff Engineer Package Technology Development

Posted by Infineon Technologies • Ipoh, Perak, Malaysia

📍 Ipoh, Perak 🕒 March 01, 2026

About the Role

To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved.

Your Role

Key responsibilities in your new role:

  • Responsible for all technical aspects of new product/package/new process development.
  • Ensure that the project meets customer requirements in terms of timeline, cost and quality.
  • Provide and/or review design proposals for package including components.
  • Provide technical direction related to problem solving of process and reliability issues.
  • Close interaction with the cross functional team for new product design and project roadmaps.
  • Work closely with the subcon engineering teams to ensure process readiness and effective execution of development activities to meet Infineon project requirements.

Your Profile

Qualifications and skills to help you succeed:

  • Master / Bachelor Degree ...

Ready to Apply?

Submit your application today and take the next step in your career journey with Infineon Technologies.

Apply Now