Full-time
Senior SMT Packaging & PCB Module Engineer
Posted by Intel Corporation • Kulim, Kedah, Malaysia
About the Role
A leading semiconductor firm seeks a Packaging Module Development Engineer in Kulim, Malaysia. This role involves developing solutions for SMT processes and printed circuit boards, conducting failure analyses, and collaborating with cross-functional teams to enhance manufacturing capabilities. Ideal candidates possess a relevant degree and extensive experience in semiconductor assembly processes. The position requires an on-site presence.
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