Full-time
Senior Package Development Leader - Backend Assembly
Posted by Nexperia • seremban, negeri sembilan, Malaysia
About the Role
Nexperia is seeking a technical leader for the Package Development team to lead backend assembly and package platform development. This role involves strategic definition, execution of technology roadmaps, and management of cross-functional collaboration, as well as coaching team members to enhance their technical capabilities.
The ideal candidate will have a Master’s degree in Engineering, a minimum of 10 years of experience in the semiconductor industry, and strong leadership and technical skills related to packaging processes.
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