Senior FOL Process Engineer (Wire Bond & Die Attach)

Ipoh, Malaysia

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Job Description

JOB RESPONSIBILITIES:

• Responsible for sustaining & improving the Die Attach & Wire Bond Process
• Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production.
• Monitor and maintain Assembly yield within KPI target.
• Key involvement in improving the systems to bring down scrap rate due to process excursions.
• Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly.
• Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target.
• Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically.