About the Role
JOB RESPONSIBILITIES:
- Responsible for sustaining &
improving the Die Attach / Wire Bond Process - Overall knowledge on electronics
manufacturing and must be able to collect and analyze data in order
to create engineering reports for New products and regular
production. - Monitor and maintain Assembly yield
within KPI target. - Key involvement in improving the systems
to bring down scrap rate due to process excursions. - Initiate process improvements through
effective evaluations of test/yield data and manufacturing defects
and make adjustments to process equipment accordingly. - Program, troubleshoot and maintain
manufacturing process equipment as required to meet the required
yield target. - Support engineering initiatives in
evaluating: solders, epoxies, new equipment (installations) and
recommend solutions both tactically and strategically. - Develop Manufac...
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