Full-time
Senior FOL Process Engineer — Die Attach & Wire Bond
Posted by Ams Osram • Bayan Lepas, Penang, Malaysia
About the Role
A leading semiconductor company in Penang seeks a knowledgeable engineer to develop and optimize die attach and wire bond processes for new product development. The ideal candidate must have a degree in Engineering and several years of relevant experience in the semiconductor field. Responsibilities include guiding junior staff and collaborating with R&D and manufacturing teams to ensure project targets are met. Excellent problem-solving skills and familiarity with Six Sigma methodologies are preferred.
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