Full-time
Semiconductor Packaging Engineer
Posted by Global Connect Technologies • mexico, mexico, Mexico
About the Role
- 8+ years of experience in flip-chip-BGA package design with high-speed SerDes (BSEE or similar field) or 6+ years of experience with MSEE or similar field.
- Experience with Cadence APD (Allegro Package Designer) or equivalent tools.
- Knowledge of package-level signal integrity and power integrity.
- Self-management and organizational skills.
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