About the Role
Process Engineer
Job Description
We are seeking a **Process Engineer** with a minimum of **2 years of hands-on experience** in **semiconductor back-end assembly processes** , particularly **die bonding and wire bonding** . The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.
The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.
**Key Responsibilities**
+ Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
+ Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
+ Support new product introduction (NPI), process qualification, and transfer to mass ...
Job Description
We are seeking a **Process Engineer** with a minimum of **2 years of hands-on experience** in **semiconductor back-end assembly processes** , particularly **die bonding and wire bonding** . The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.
The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.
**Key Responsibilities**
+ Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
+ Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
+ Support new product introduction (NPI), process qualification, and transfer to mass ...
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