About the Role
About the Company
Cadence Bangalore is Hiring
About the Role
We are seeking an experienced IC Package Design Engineer with strong expertise in flip‑chip package design and IC‑Package‑PCB co‑design, focusing on signal integrity (SI), power integrity (PI), and thermal optimization. The role requires close collaboration with cross‑functional teams and customers to deliver optimized, cost‑effective, and high‑performance package solutions.
Responsibilities
- Lead flip‑chip package design with a strong focus on SI/PI and thermal constraints.
- Drive IC–Package–PCB co‑design, balancing performance, power, cost, technology, and thermal trade‑offs.
- Collaborate closely with cross‑functional teams and customers to define and deliver optimal end‑to‑end solutions.
- Support...
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