Full-time
Platform Engineering Lead - Semiconductor Packaging
Posted by Infineon Technologies • Malacca City, Malacca, Malaysia
About the Role
A global leader in semiconductor solutions seeks a professional in Malacca to manage the package platform roadmap and optimize technical capabilities. The ideal candidate will have a Master’s or Bachelor’s degree in Engineering and extensive experience in the semiconductor industry. Responsibilities include overseeing the platform's life cycle and defining the release strategy. Join us in driving innovation for green, efficient energy and mobility solutions, in a diverse and inclusive work environment.
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