Full-time
Packaging Module Engineer - Direct Lid/Stiffener Attach
Posted by Intel • kulim, kedah, Malaysia
About the Role
Intel is looking for a Package Module Development Engineer in Kulim, Malaysia. The role involves defining process flows, conducting FMEA assessments, and developing strategies for problem resolution in the manufacturing process.
Qualifications include a Bachelor’s or Master's degree in relevant fields, knowledge in statistical design of experiments, and preferred experience in semiconductor process development. The position emphasizes collaboration, training of engineers, and improvement of process efficiency.
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