Full-time
Packaging Module Engineer — Direct Lid & Stiffener (Onsite)
Posted by Intel • Kulim, Kedah, Malaysia
About the Role
A leading semiconductor company in Kulim, Malaysia is seeking a recent graduate for a role focused on developing innovative packaging technologies. Candidates must have a Bachelor's or Master’s degree in relevant engineering fields and be involved in research and development. The position entails optimizing manufacturing processes and requires knowledge in statistical design and problem-solving techniques. A strong understanding of data science tools like JMP/SQL and AI/ML is advantageous. This role necessitates regular onsite presence.
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