Packaging Module Development Engineer

Job Details:

Job Description: 

- Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization
- CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process
- Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product.
- Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
- Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
- Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
- Optimizes and improves the efficiency of manufacturing...