About the Role
Job Details
Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization
CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process
Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product.
Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Optimizes and improves the efficiency of manufacturing of packages, de...
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