Full-time
Packaging Engineer - Inductor and Power Module
Posted by Texas Instruments • Japan, Japan, Japan
About the Role
The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist
+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.
+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.
Ready to Apply?
Submit your application today and take the next step in your career journey with Texas Instruments.
Apply Now