full-time

Packaging Development Engineer (NCG)

Posted by Sandisk • Shanghai, Shanghai, China

📍 Shanghai, Shanghai 🕒 March 01, 2026

About the Role

Job Description

  1. Packaging Development Engineer
  2. New technology, material and equipment design, development and deployment in co-operation with internal and external team. 
  3. New product design, development and deployment until product move to mass production.
  4. Bring innovation solution and technology across new technology and new product development.
  5. Team work in English language with a multitude of international interfaces is mandatory.

Qualifications

  1. Master degree with major in material science / Mechatronic Technology as priority. 
  2. Preferred intern in assembly technology especially in SanDisk or similar company.
  3. Passion for developing technical solutions in multidisciplinary international projects
  4. Excellent English skills (verbal and written); willingness to travel as required.


Additional Information

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