About the Role
Overview
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
We are seeking a Package Design Engineer with hands-on experience in Organic and Advanced 2.5D/3D Chiplet packaging. The ideal candidate is proactive, technically curious, and driven to improve design velocity through SIPI-aware methodologies, AI automation, and strong cross-functional collaboration.
This role is hybrid
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