Full-time

Operator (Clip Bond/Wire Bond)

Posted by Onsemi • Lapu-Lapu City, Central Visayas, Philippines

📍 Lapu-Lapu City, Central Visayas 🕒 February 26, 2026

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About the Role

To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.
Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack
Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college

Job Details

Location Lapu-Lapu City, Central Visayas
Job Type Full-time
Category Other Production Occupations
Posted February 26, 2026
Deadline April 07, 2026

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