Manager, Process Module Engineering

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• To lead Die Attach Process Module Engineering team for Process/Materials Development, Qualification and Transfer to HVM.
• Responsible for Key technology development & tech-staging to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
• To lead or co-lead Development JET (Joint Engineering Team) with global cross-functional teams incl. process, materials, CPI, package design, thermal-mechanical simulation, quality and other related stakeholders.
• To build and nurture strong process development team related to high density ultra-thin die attach process, material and packaging architecture - emphasizing deep engineering fundamental, structured methodology and DOE planning / execution / analysis.
• To lead studies related to in-depth fundamental investigation/characterization in packaging development.