Ic packaging simulation engineer

Roles & Responsibilities:
· Perform thermal, stress, warpage, electrical simulations post package designing to meet product data requirements based on customer specifications.
· Knowledge of electrical and package simulation in relation to substrate design and data analysis.
· Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction.
· Deep understanding of packaging materials and their mechanical behaviors.
· Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a plus.
Requirements:
· Bachelor or Master Degree in Electrical, Mechanical, or Materials Science Engineering.
· Good understanding of Advanced Packaging architecture and semiconductor packaging process flow.
· Handson experience in using package simulations software tools & FEM tools such as Celsius Thermal Solver / Clarity IC Package Extraction...