Full-time
IC Packaging Method Engineer (1-Year Contract)
Posted by Nexperia • seremban, negeri sembilan, Malaysia
About the Role
Nexperia is looking for an Application Engineer in Seremban, Malaysia. This role focuses on developing packing methods and ensuring product quality throughout the development process according to EIA/IEC Standards.
The ideal candidate will have a degree in Engineering or Materials Science, knowledge of IC package design, and strong problem-solving skills. Experience with Design FMEA and CAD is essential.
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