Graduate Process Engineer

Job Description
As a
Die Bond & Wire Bond Engineer
, you will be part of a dynamic manufacturing team, supporting semiconductor assembly processes from development to mass production. This role is ideal for fresh graduates who are eager to learn, hands-on, and passionate about process improvement.

• Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability
• Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment-related problems
• Participate in new product introduction (NPI), process qualification, and transition to mass production
• Help establish and update process parameters, work instructions, and control plans
• Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis
• Work closely with cross-functional teams including Production, Quality, Equipment, and R&D ...