Full time

ENGR STAFF, PACKAGE DEV; PKG&ASSY

Posted by Onsemi • Seremban, Negeri Sembilan, Malaysia

📍 Seremban, Negeri Sembilan 🕒 June 10, 2026

Apply for this Job Similar Jobs

About the Role

Job Summary: 
This job requires a full-time Staff engineer with strong engineering knowledge and skills in wire bond equipment and process for early engagement in technical problem-solving, cross-site collaboration to support NPD qualification and high-volume manufacturing (HVM)
Lead the development, optimization, and qualification of wirebond processes for new and existing semiconductor packages, ensuring robust manufacturability, reliability compliance, and alignment with technology roadmaps.
Good knowledge in Six Sigma methodology and the DMAIC approach.
Practice good quality system and production control.
Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition. 
Requirements:
Minimum Bachelor's / Master Degree in Electronic, Electrical, Microelectronic, Mechatronic Engineering or equivalent.
Minimum of 8 years work experience as...
                

Job Details

Location Seremban, Negeri Sembilan
Job Type Full time
Category Engineers
Posted June 10, 2026
Deadline July 20, 2026

Ready to Apply?

Submit your application today and take the next step in your career journey with Onsemi.

Apply Now