Full-time

Engr Prin, Package Development

Posted by onsemi • Seremban, Negeri Sembilan, Malaysia

📍 Seremban, Negeri Sembilan 🕒 March 01, 2026

About the Role

Job Description
Job Summary:

  • Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development.
  • Key person responsible to align processes between R&D and Manufacturing.
  • Establish process POR through set up, feasibility and characterization followed by package development procedure.

Responsibilities
RESPONSIBILITIES

  • End of Line process development and enabling technology for molded package.
  • Capable to understand the design and proposal for improvement from End of Line process.
  • Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
  • Familiar with EMC materials.
  • Capability to define KPIV from failures modes.
  • Capability to define KPOV and generate output by analyzing process capability.
  • Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
  • Effectively working with...

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