Full-time

Engineer Unit Process Engineering Die Attach

Posted by Infineon Technologies • Melaka, Melaka, Malaysia

📍 Melaka, Melaka 🕒 February 26, 2026

About the Role

Quality improvement activities on DDM investigation, disposition and improvement.

Your Role
Key responsibilities in your new role

  • Yield improvement activities for Die Attach process.
  • Sustain and achieve stability index for package under responsibility.
  • Support production on daily issues investigation and improvement in order to achieve Operation performance.
  • Sustain and achieve quality stability for DA process to achieve zero spill, FAR.
  • Documents update and refine to ensure no expired documents.
  • Key driver for yield improvement topic for Die Attach process.

Your Profile
Qualifications And Skills To Help You Succeed

  • Bachelor degree in engineering.
  • Knowledge in die attach process and skill.
  • Knowledge in process engineering.
  • Basic statistical and SPC knowledge.
  • Basic problem solving skill.

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