Engineer, Advanced Wafer Level Package

Your Job

As an Advanced Wafer Level Package (WLP) Engineer, you will lead the development of cutting-edge wafer-level packaging technologies. Your role encompasses pioneering heterogeneous integration, 2.5D/3D packaging, chiplet integration, and high-density interconnect solutions. You will develop and validate advanced packaging processes such as RDL, TSV, Hybrid Bonding, Micro-bump, and Fan-Out. Additionally, you will perform material characterization, analyze packaging structures, resolve reliability issues, and collaborate closely across functions to ensure successful technology implementation and prototype development.

Our Team

You will be part of the DSS Division, within the R&D Component Engineering department, working closely with the Advanced WLP Senior Manager and cross-functional teams including design, integration, testing, reliability, as well as external partners such as material, equipment, and substrate suppliers. Our team is dedica...