Full-time

Direct Lid/Stiffener Attach Packaging Module Development Engineer

Posted by Intel Corporation • Kulim, Kedah, Malaysia

📍 Kulim, Kedah 🕒 March 01, 2026

About the Role

# **Welcome!**## .Direct Lid/Stiffener Attach Packaging Module Development Engineer page is loaded## Direct Lid/Stiffener Attach Packaging Module Development Engineerlocations: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR # **Job Details:**## Job Description:* Note: This role requires regular onsite presence to fulfill essential job responsibilities.* Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.* Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.* Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.* Develops and maintains equipment to evaluate silicon and package technologies under...

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