Die Attach TD Module Engineer

Job Details:

Job Description:

The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD in Asia initiative.

• The candidate will define and establish process flow, procedures, and equipment configuration for NPI products.
• Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Plans and conducts experiments to fully characterize the process throughout the development cycle.
• Drives improvements on quality, reliability, cost, yield, process stability/proficiency, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.
• Develops solutions to problems utilizing formal education, statistical knowledge, and proble...