Full-time
DIE attach module engineer
Posted by Intel Technology (m) Sdn Bhd • Kulim, Kedah, Malaysia
About the Role
Looking for Semiconductor Assembly DIE Attached module engineer. location: Kulim
Minimum Qualifications:
- Bachelor's degree in Materials/Mechanical/Chemical/Electrical Engineering or related field.
- At least 2 years hands-on experience in die attach/TCB, flipchip, or semiconductor assembly process.
- Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and finepitch alignment.
- Proficiency in SPC and datadriven problem solving.
- Experience with metrology analytics. ex: Xray, warpage measurement, optical inspection (AOI), microscopy.
- Ability to work in Class 10k-100k cleanroom with PPE.
Ready to Apply?
Submit your application today and take the next step in your career journey with Intel Technology (m) Sdn Bhd.
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