Home / Jobs / Design Engineering Intern
Temp (Payroll)

Design Engineering Intern

Posted by Qorvo • Osaka, Osaka, Japan

📍 Osaka, Osaka 🕒 February 27, 2026
Apply for this Job Similar Jobs

About the Role

Responsibilities

:
  • Producing and implementing designs to meet customer specifications for:

  • Low cost and thermally efficient package platforms

  • LTE, carrier aggregation, multiple antennas, filters, and power management

  • Ruggedness, ESD, and quality

  • Meeting performance requirements while also considering size, cost, footprint, and schedule

  • Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data

  • Partnering with technicians to perform circuit simulations and testing as needed

  • Designing, testing, and tuning of RF PAs

  • Developing and executing test plans for electronics package mechanical robustness

  • Developing application guidelines for package assembly into next level assembly

  • Creating basic algorithms for automating FEA model generation

  • Potential to work with:

  • Sig...

    • Job Details

    • Location Osaka, Osaka
    • Job Type Temp (Payroll)
    • Category Engineers
    • Posted February 27, 2026
    • Deadline April 08, 2026

    Ready to Apply?

    Submit your application today and take the next step in your career journey with Qorvo.

    Apply Now