About the Role
Your Role
Key responsibilities in your new role
Qualifications and skills to help you succeed
Key responsibilities in your new role
- Responsible for Wire Bond Development in A project and any assigned projects with objective of ensuring the project target and scope are meeting the corporate goals.
- To convert and set-up die bonder/ wire bonder in preparation for new evaluation/ engineering/ qualification build.
- To perform engineering data measurement, collection and data compilation.
- Capable to analyze the engineering data in case of abnormality.
- To support builds from development to baseload/ramp up.
- To provide technical support from development to baseload/ ramp up.
- To perform other duties as assigned by superior.
Qualifications and skills to help you succeed
- Minimum Diploma in Mechanical/ Electronic/ Electrical Engineering.
- 5 years working experience in semiconductor with die attach and wire bond process experience preferable on Die bonder : ESE...
Ready to Apply?
Submit your application today and take the next step in your career journey with Infineon.
Apply Now