About the Role
Job Details:
Job Description:
Become a member of the Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team in Kulim as a laser development engineer leading the development and deployment of Intel's advanced chip packaging process technology.
- In this position, you will be responsible for developing laser marking, laser barrier, laser ablation and micro drilling next generation semiconductor packaging technology.
- Your responsibilities include, but are not limited to, development of laser process recipes and understanding material interactions while delivering to our quality and reliability standards.
- In addition, you will be engaging in testing and validating hardware/software upgrades to meet product requirements.
- Laser Development Engineers respond to customer requests or challenges, develop solutions to problems...
Ready to Apply?
Submit your application today and take the next step in your career journey with Intel.
Apply Now