ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a process integration engineer in Micron’s Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for process development with integration scheme for memory devices application. 

In this position, you will work with process module team, data science team, defect team to develop unit processes that meet product spec and device requirements for HBM products. 

Additionally, real time yield and defect analysis, inline WIP control and escalate for any potential issues are needed. 

RESPONSIBILITIES: 

· Yield and quality improvement for HBM products to support product milestone deliverables.