Full-time
Advanced Packaging Engineering Lead - InFO/CoWoS & NPI
Posted by AMD • Bayan Lepas, Penang, Malaysia
About the Role
A leading semiconductor company in Bayan Lepas is seeking a highly motivated Packaging Engineering Manager to lead assembly manufacturing processes. The ideal candidate has at least 5 years of experience in InFO or packaging engineering, with proven abilities in project management and cross-functional collaboration. This role involves improving packaging yield and quality, and managing assembly manufacturing sites. A Bachelor's or Master's in Mechanical, Material, or Chemical Engineering is required, along with strong communication skills.
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