Advanced Packaging Engineer (Bumping/Lithography)

Candidate is required to work closely with oSATs and cross-functional teams to bring up and sustain for InFO, Bumping, EFB/CoWoS-L,CoWoS-S, WLFO, FCBGA, LGA and chiplet packages.

THE PERSON:

The ideal candidate will have a balanced mix of strong technical knowledge as well as program management experience in InFO, Bumping, EFB/CoWoS-L,CoWoS-S, WLFO, FCBGA, LGA and chiplet package functions.

The successful candidate must be a team player with a commitment to meeting deadlines. Lead & drive for solutions with an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, with strong interpersonal skills and good communication & presentation skills. He or she must have good command of both written and spoken English.

KEY RESPONSIBILITIES:

Responsible for InFO, Bumping, EFB/CoWoS-L, CoWoS, WLFO, FCBGA, LGA and Chiplet package Manufacturing readiness for New Product ...