Full-time
Wire Bond Process Engineer: Yield & SPC Optimization
Posted by Fairwork • ipoh, perak, Malaysia
About the Role
Fairwork is seeking a qualified candidate to enhance the Wire Bond Process in Ipoh, Malaysia. Responsibilities include improving assembly yield, analyzing data for manufacturing reports, and supporting engineering initiatives. The role requires a Bachelor’s degree in electronics or electrical engineering, along with experience in high-volume manufacturing.
Preferred candidates will have strong analytical skills and experience in process problem solving. Leadership experience is also an advantage.
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