Full-time

Sr. Staff Package Design Engineer - Power Modules

Posted by Renesas Electronics • Taiwan, Taichung City, Taiwan

📍 Taiwan, Taichung City 🕒 June 08, 2026

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About the Role

Job Description
Renesas is seeking a package expert for its AI High Density Power Modules product families. These products push the technology limits of speed, density, and efficiency and deliver power to the highest performance computing and connectivity functions. Typical applications include Artificial Intelligence, High Performance Networking, and other High Performance Computing applications. This role sits within our Performance Computing Power business, which is one of the fastest-growing and exciting product lines at Renesas, with a multi-market scope and a large product development team.
Work closely with cross-functional teams to provide the package design of a power module and produce 3D drawings
Help develop and correlate mechanical warpage, stress, and thermal modeling of the components in power modules
Generate detailed documentation of simulation results for internal and external stakeholders
Develop test plans, test documentati...
                

Job Details

Location Taiwan, Taichung City
Job Type Full-time
Category Engineers
Posted June 08, 2026
Deadline July 18, 2026

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